3D & System-in-packages summit to spotlight latest in 3d roadmap, heterogeneous integration, and system in package technologies
Top experts in 3D integration and systems for semiconductor manufacturing will gather at the annual SEMI 3D & Systems Summit, 27-29 January 2020, in Dresden, Germany, for the latest developments and insights in the 3D roadmap, heterogeneous integration and system-in-package technologies.3D in packaging and transistor cell design is critical to scaling the performance of integrated circuits to meet the demands of artificial intelligence (AI), machine learning and other data-intensive applications. Registration is now open with early-bird pricing until 30 November 2019.
SEMI 3D & Systems Summit returns to Dresden for the second year with a broader scope of topics including:
- 3DIC Through-Silicon-Via (TSV) technology
- 2.5D, 3D FO-WLP/e-WLB
- Heterogeneous Integration
- Stacked dies and stacked wafers
- 3D alternative technologies
- 5G applications
- uLED and photonics applications
Experts from Global Leaders to Present
Event speakers will explore disruptive applications such as the mobile Internet of Things (IoT) and high-performance power electronics. 3D & Systems Summit presenters include experts from global leaders such as AMKOR, ASE Group, Dow, GLOBALFOUNDRIES, Savansys, SystemPlus, STMicroelectronics, TechSearch International, Yole Développement and Xperi.
The summit will showcase prominent players in 3D integration for microelectronics manufacturing while offering business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities. Visit 3D & Systems Summit for more information.
To reserve exhibition space, contact Revi Gani at firstname.lastname@example.org.