Client Use Case
Legacy Semiconductor Assembly Equipment (Wire Bonder)
Equipment
- Machine: Shinkawa UTC-200 Wire Bonder
- Process: Semiconductor Assembly & Packaging
- Challenge: No native SECS/GEM support for modern MES integration
Business Challenge
The Shinkawa UTC-200 is a highly reliable legacy wire bonder widely used in semiconductor packaging fabs. However, the equipment lacks built-in SECS/GEM (SEMI E30) communication, making it incompatible with modern Manufacturing Execution Systems (MES).
The customer faced challenges, including:
- No real-time equipment status visibility
- Manual data collection and reporting
- Inability to integrate with factory automation systems
- Risk and cost associated with invasive controller modifications or equipment replacement
eInnoSys Solution
EIGEMBox – Plug-n-Play SECS/GEM Integration Solution
eInnoSys deployed its EIGEMBox SECS/GEM solution, a non-invasive, plug-and-play integration platform designed specifically for legacy semiconductor equipment.
Key solution elements:
- SECS/GEM server implemented using the advanced SECS GEM SDK
- No modification to Shinkawa UTC-200 hardware or controller
- Acts as a protocol translator between equipment and MES/Host
- Full SEMI E30 compliance
Key Features Implemented
- Equipment state model (Offline / Local / Remote)
- Real-time production data collection
- Alarm and event management
- Remote start/stop and control commands
- Recipe upload/download and management
- Equipment constants and parameter mapping
- Web-based configuration and monitoring
Implementation Timeline
- Site Survey & I/O Assessment: 1 Day
- Hardware Installation: Few Hours
- SECS/GEM Configuration & Mapping: 1–2 Days
- Host Communication Testing: 1 Day
- Production Go-Live: Within 3–5 Days
Business Impact & Results
- 10–18% improvement in OEE
- 8–15% increase in equipment utilization
- 20–30% reduction in unplanned downtime
- Elimination of manual data entry
- Faster decision-making with real-time MES visibility
- Payback period: 12–18 months
Why EIGEMBox Was Chosen
- No risk to equipment reliability
- No warranty impact
- Much lower cost vs. equipment replacement
- Rapid deployment
- Scalable for multiple tools
- Future-ready architecture supporting SEMI standards
Technologies & Standards
- SECS/GEM (SEMI E30)
- SECS-II (E5), HSMS (E37)
- Industrial IoT Architecture
- MES / Host Integration
- Web-based Configuration UI
Conclusion
The SECS/GEM integration on the Shinkawa UTC-200, using EIGEMBox, successfully transformed a legacy wire bonder into a fully connected smart factory asset. The solution enabled modern factory automation without invasive modifications, delivering measurable productivity gains and long-term value.
