SEMI E157 Module Process Tracking
- SEMI E4
- SEMI E5
- SEMI E148
- SEMI E84
The Challenge of Process Visibility
Imagine running a multi-chamber etch tool processing twelve wafers simultaneously across four different chambers. Chamber 1 just finished step 3 of the recipe while Chamber 2 is starting step 5. Meanwhile, you need to know exactly what happened in each chamber, when it happened, and which wafers were affected. Without a standard way to track this, you’re flying blind. That’s the problem SEMI E157 solves.
The SEMI E157 Standard defines how equipment reports recipe execution and process data at the module level—giving you visibility into what’s happening inside each process chamber or module independently. This isn’t just about collecting data; it’s about linking that data to context so you can actually use it for yield improvement, process optimization, and troubleshooting.
What Makes SEMI E157 Module Process Tracking Different
Traditional data collection often treats equipment as a black box. You know wafers went in and came out, but what happened inside? The Module Process Tracking SEMI E157 specification changes this by providing module-specific reporting. Each process chamber or module reports its own recipe execution, process parameters, and substrate tracking independently.
Here’s why this matters: in a batch processing tool, all chambers might be running the same recipe but at different steps—or they might be processing different products entirely. Semiconductor module process tracking lets you correlate process data with the exact substrates that were in that specific module at that specific time during that specific recipe step. That level of granularity is essential for modern process control.
Example Process Module Event Flow
Process Module : Chamber_A
Substrate ID : LOT123_WFR05
Process Job ID : JOB_2024_001
Event : ProcessModuleRecipeStepStart
Recipe ID : "ETCH_OXIDE_V3.2"
Recipe Step : "Main_Etch"
Step Number : 3
Timestamp : 2024-12-16T10:23:45.123Z
Event : ProcessModuleRecipeStepEnd
Step Duration : 45.7 seconds
Process Data:
{
"RF_Power" : 1250 W,
"Pressure" : 15.3 mTorr,
"Flow_O2" : 50 sccm,
"EndpointDetected" : true
}
Timestamp : 2024-12-16T10:24:30.856Z
Real-World Impact: When a yield issue surfaces, you need to trace it back. With SEMI E157 equipment tracking, you can identify that specific wafers processed in Chamber B during step 4 between 2 PM and 3 PM had the issue, while wafers in Chamber A at the same time were fine. That narrows your investigation from “maybe the whole tool” to “definitely Chamber B, probably step 4.”
Two Tracking Approaches in SEMI Standard E157
The SEMI E157 specification defines two complementary ways to track process execution, and equipment can implement either or both depending on their architecture.
Module-Based Tracking
- Designed for multi-chamber equipment
- Each module reports independently
- Module-specific process parameters
- Batch processing with simultaneous start/end
- Different recipes per module supported
- Chamber-level troubleshooting capability
Continuous Flow Tracking
- Individual substrate tracking
- Staggered recipe execution timing
- Single wafer or batch reporting
- Step-by-step recipe progression
- Works with module-based equipment too
- Flexible for various tool architectures </u
Context Data: The Missing Link
Raw process data without context is nearly useless. The SEMI equipment tracking standard requires reporting context information alongside process data. This includes substrate identification (which wafers were being processed), recipe information (which recipe and which step), process job identification (linking to MES systems), and timing data (when each step started and ended).
This context linking is what enables advanced applications. Your statistical process control system can correlate RF power variations with specific recipe steps. Your predictive maintenance algorithms can track chamber performance across thousands of recipe executions. Your yield analysis can connect process excursions to affected lots. None of this works reliably without standardized context data.
Recipe Step Granularity
The SEMI E157 semiconductor standard goes beyond just reporting when a recipe starts and ends—it tracks individual recipe steps. A typical semiconductor process recipe may include 10–20 steps such as chamber conditioning, substrate transfer, multiple processing stages with varying parameters, and cleaning steps. Process module tracking in semiconductor fabs reports the start and completion of each step along with the relevant process parameters.
This step-level visibility is crucial because issues often occur during specific steps. For example, the main etch step may perform correctly while the post-etch clean occasionally fails. With recipe step tracking, each step can be monitored independently, allowing deviations to be detected early before they impact product quality.
Integration with Factory Systems
The SEMI E157 semiconductor standard goes beyond just reporting when a recipe starts and ends—it tracks individual recipe steps. A typical semiconductor process recipe may include 10–20 steps such as chamber conditioning, substrate transfer, multiple processing stages with varying parameters, and cleaning steps. Process module tracking in semiconductor fabs reports the start and completion of each step along with the relevant process parameters.
This step-level visibility is crucial because issues often occur during specific steps. For example, the main etch step may perform correctly while the post-etch clean occasionally fails. With recipe step tracking, each step can be monitored independently, allowing deviations to be detected early before they impact product quality.
Benefits for Factory Operations
Implementing semiconductor equipment process tracking through SEMI E157 delivers tangible operational benefits. You gain faster root cause analysis when yield issues occur because of module-level visibility. Process optimization becomes data-driven rather than guesswork, as you clearly understand what happens inside each module. Equipment utilization also improves by identifying underperforming chambers and addressing them individually.
Regulatory compliance becomes easier as well. When auditors ask to prove that a specific lot was processed according to specifications, you can provide detailed records of every recipe step execution, including timestamps, process parameters, and substrate identification. This level of traceability is exactly what modern semiconductor manufacturing demands.
Moving Forward with Module Tracking
As equipment becomes more complex with additional process modules and increasingly sophisticated recipes, the need for detailed process tracking continues to grow. The SEMI E157 Module Process Tracking standard provides a structured framework to capture this complexity in a standardized and usable way. Whether implemented on new equipment or retrofitted onto legacy systems, the investment delivers measurable value through improved process control, faster issue resolution, and higher manufacturing yields.
SECS/GEM Integration Products
Fabs & Assembly/Test/Packaging Products
- SECS/GEM addition & enhancement on legacy equipment – EIGEMBox & EIGEM-HMI
- E84 & E87 addition on legacy equipment – EIGEMBox
- AI/ML-based health monitoring & predictive maintenance – XPump
- Factory host – EIStationController
- Recipe Management System – EIRMS
- AI/ML based Smart FDC with Predictive Analytics – SeerSight
- Analog Gauge Monitoring – EIGaugeMonitor
- Equipment Simulator – EIGEMSim
- Factory host SDK – EIGEMHost & EIGEM300Host
- Chemical Management – EIBarcodeGuardian
- Spare Parts & Vendor Management – EICMMS
OEMs (Original Equipment Manufacturer) Products
Ready to Implement Module Process Tracking?
Einnosys specializes in SEMI standards implementation for equipment automation software. We can help you deploy SEMI E157 module process tracking across your facility, integrate it with your existing factory systems, and leverage the data for continuous improvement.
FAQs About SECS/GEM SDK & Integration in Malaysia
What is SEMI E157 Module Process Tracking?
SEMI E157 is a semiconductor equipment automation standard that defines how process execution and process data are reported at the module or chamber level. It enables detailed visibility into recipe execution, process steps, and substrate tracking within multi-chamber and complex manufacturing equipment.
Why is module-level process tracking important in semiconductor manufacturing?
Modern semiconductor tools often contain multiple process chambers operating simultaneously. Module-level tracking allows fabs to understand exactly what happened inside each chamber, when it happened, and which substrates were affected—making root cause analysis, yield improvement, and troubleshooting significantly faster and more accurate.
How is SEMI E157 different from traditional equipment data collection?
Traditional data collection treats equipment as a black box, reporting only when wafers enter and exit the tool. SEMI E157 provides chamber-specific reporting, including recipe steps, process parameters, timestamps, and substrate identification, enabling detailed, context-aware process analysis.
What types of tracking does SEMI E157 support?
SEMI E157 defines two complementary tracking approaches:
Module-Based Tracking – Ideal for multi-chamber equipment where each module reports independently
Continuous Flow Tracking – Tracks individual substrates through staggered recipe execution and step progression
Equipment can implement either or both depending on architecture.
What kind of context data is reported with SEMI E157?
SEMI E157 requires reporting critical context data alongside process values, including:
Substrate or wafer ID
Recipe ID and recipe step
Process job ID (linked to MES)
Start and end timestamps for each step
This context is essential for meaningful data analysis.
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